coondoggie writes: "IBM and 3M today said they will jointly develop a new line of adhesives they hope will let them make it possible to build commercial microprocessors composed of layers of up to 100 separate chips. Such stacking would allow for higher-powered servers and more advanced consumer electronics applications, the companies stated. Processors could be tightly packed with memory and networking, for example, into a "brick" of silicon that would create a computer chip 1,000 times faster than today's fastest microprocessor enabling more powerful smartphones, tablets, computers and gaming devices."
Top Ten Things Overheard At The ANSI C Draft Committee Meetings:
(3) Ha, ha, I can't believe they're actually going to adopt this